Filler-containing resin composition suitable for injection molding and transfer molding

ABSTRACT

A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 μm and not greater than 1.5 μm (x component), a globular powder of which mean particle diameter is not smaller than 2 μm and not greater than 15 μm (y component) and a globular powder of which mean particle diameter is not smaller than 20 μm and not greater than 70 μm (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.

This is a division of application No. 08/487,628, filed Jun. 7, 1995,now U.S. Pat. No. 5,719,225.

FIELD OF THE INVENTION

The present invention relates to a filler-containing resin compositionsuitable for injection molding and transfer molding, and particularly toan epoxy resin composition useful as a sealing material for electronicparts.

BACKGROUND OF THE INVENTION

Today, sealing of semi-conductors such as LSI, IC, transistor and thelike is carried out by the transfer molding of epoxy resin compositionsbecause of their inexpensiveness. Particularly in the recent years,surface mounting of LSI is prevalent and direct dipping ofsemi-conductor package in solder bath is adopted with increasingfrequency at the time of mounting semi-conductors on a substrate. Atthis time, the sealed package is exposed to a high temperature of 200°C. or above, so that the moisture in the sealed package expands to formcracks. Further, the thermal stress causes a peeling at the interfacebetween elements or metallic frame and sealing material. As its result,moisture or the like penetrates through the cracks or peeled interfaceinto the package to cause defective elements. For this reason, a sealingresin material is required to be low in moisture absorption and high incrack resistance. At present, epoxy compounds such as o-cresol novolacglycidyl ether, tetramethyl-biphenol glycidyl ether and the like areusually mixed with an inorganic filler such as silica or the like andused as the sealing material. As a technical trend of the time, anincrease in the content of filler is being studied. For example, byincreasing the content of a silica type filler, the moisture absorptiondue to resin can be decreased, and the difference between thermalexpansion coefficients of silicon tip and semi-conductor package can beminimized. By this method, the stress at high temperature can berelaxed, and thereby the occurrence of package crack and peeling can beavoided effectively.

From the viewpoint of the above-mentioned technical trend, it may bethought that to increase the content of silica type filler as possibleis effective. Actually, however, there is an upper limit in the contentof filler. For example, in case of using a single globular filler, whichis close to the ideal mono-dispersed state, the flow of molten epoxyresin sealing material is extremely short when the content of filler isapproximately 80% by weight in the epoxy resin sealing material. Whenthe content of the filler is 84% by weight, the fluidity of sealingmaterial substantially disappears, so that an element placed in the diecannot be sealed. In order to avoid this phenomenon, a multi-componentfiller is usually used. However, when a filler is used at a high fillingrate, an increase in the amount of filler by only a few percents candecrease the actual flow to one half or less and make the productunusable.

Generally speaking, when one kind of globular filler is used, the fillercannot be filled in an amount exceeding the hexagonal closest packing(74% by volume). Accordingly, a means of filling small-sized globules inthe gaps between large-sized globules is effective for achieving a highfilling rate. A number of superior studies for achieving the highfilling rate by using a multi-component filler have been published basedon this idea. Concretely speaking, the use of two kinds of fillersdifferent from each other in mean particle diameter (JP-B-63-26128), theuse of two kinds of fillers one of which is a globular filler and theother of which is a minute globular filler (JP-A-5-239321), the use ofthree kinds of fillers two of which are globular particles and the thirdof which is a frag- mental particle (JP-A-5-230284), the use of threekinds of powdery silicas in which the mixing ratio of the three silicasis different from that of the present invention (JP-A-2-261856), etc.can be referred to. As demonstrated by their respective workingexamples, all of the compositions disclosed in these prior patents showan excellent fluidity in the molten state and an excellent curingmoldability when the amount of filler is approximately 80% by weight. Ifthe amount of filler reaches about 90% by weight, however, all of theseresin compositions become inferior in flow property and difficult toform into a package.

There may be another means for increasing the content of silica typefiller by reducing the viscosity of epoxy resin used. Generallyspeaking, however, a reduction in the viscosity of epoxy resin bringsabout a drop in the glass transition temperature (Tg) of cured product.Since dynamic properties of cured product are not good in thetemperature range exceeding Tg, a sealing material having a high Tg isdemanded in the fields in which the package itself requires a high heatresistance, such as power IC, etc. If a polyfunctional epoxy compoundsuch as o-cresol novolac glycidyl ether or the like is used, Tg can beelevated to 150°-200° C. However, melt viscosity of such sealingmaterial is relatively high, so that a high content of silica fillerenough for preventing the package crack cannot be realized. That is, ifthe content of silica filler is increased to a level enough to preventthe package crack, fluidity of resin composition is greatlydeteriorated, due to which molding cannot be practiced. As above, a highcontent of silica filler and achievement of high Tg have hitherto beenin a contradictory relation.

There is known an innovative proposal using a maleimide compoundtogether with three or four kinds of globular silicas as filers(JP-A-4-285617). According to this proposal, the smallest particle has asize of 0.1 μm or less. However, such super-fine particles are easilyagglomerated, and the agglomerate behaves as if it were a large-sizedparticle in the resin composition. Even though this difficulty may beovercome by dispersing the agglomerate to the primary particles, theactual fluidity of the resin composition greatly depends on the methodof kneading and the degree of dispersion of filler, and a reproducibleresult is difficult to obtain.

As another method for avoiding the package crack, a method of elevatingheat resistance of resin itself and a method of lowering the stress by amodification using reactive silicone are known. According to thesemethods, package crack can be prevented even when the amount of filleris 65-80% by weight based on the resin composition. However, therealization of a high heat resistance by elevation of functionality andthe lowering of stress by the use of silicone bring about a furtherincrease in the viscosity of resin component, which decreases the degreeof freedom in formulation regarding addition of other components orincrease in the amount of silica which are necessary for improvingperformances while maintaining a sufficient fluidity. As above, animprovement in the performances of a sealing material and an increase ofits fluidity are also in a contradictory relation.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a molding resincomposition excellent in fluidity and capable of giving a molded producthaving a low moisture absorption property and a low thermal expansioncoefficient.

After extensive studies, the present inventors found that a resincomposition prepared by compounding specified fillers at a specifiedcompounding ratio can achieve the object of the present invention. Basedon this finding, the present invention was accomplished. Thus, theessentiality of the present invention is as follows:

(1) A molding resin composition containing, in a resin, a fillercomprising a globular powder of which mean particle diameter is notsmaller than 0.1 μm and not greater than 1.5 μm (x component), aglobular powder of which mean particle diameter is not smaller than 2 μmand not greater than 15 μm (y component) and a globular powder of whichmean particle diameter is not smaller than 20 μm and not greater than 70μm (z component), wherein proportions of the x, y and z components basedon the total volume of x, y and z components are not smaller than 10% byvolume and not greater than 24% by volume, not smaller than 0.1% byvolume and not greater than 36% by volume and not smaller than 57% byvolume and not greater than 76% by volume, respectively.

(2) A molding resin composition containing, in a resin, a fillercomprising a globular powder of which mean particle diameter is notsmaller than 0.1 μm and not greater than 1.5 μm (x component), aglobular powder of which mean particle diameter is not smaller than 2 μmand not greater than 15 μm (y component), a globular powder of whichmean particle diameter is not smaller than 20 μm and not smaller than 70μm (z component), and a fragmental powder (m component), whereinproportions of the x, y and z components based on the total volume of x,y and z components are not smaller than 10% by volume and not greaterthan 24% by volume, not smaller than 0.1% by volume and not greater than36% by volume and not smaller than 57% by volume and not greater than76% by volume, respectively, and a proportion of the m component is notsmaller than 1% by weight and not greater than 30% by weight based onthe total weight of x, y, z and m components.

(3) A molding resin composition according to the above-mentionedparagraphs (1) or (2), which contains an epoxy resin of which meltviscosity at 150° C. is lower than 1 poise, a phenolic curing agent, acuring accelerator and a silica type filler comprising x, y, z and mcomponents as indispensable ingredients, wherein the content of thesilica type filler is not lower than 83% by weight and not higher than94% by weight based on the total composition and the spiral flow of thecomposition is 20 inches or above as measured according to the standardof EMMI-1-66 at 175° C. under a pressure of 70 kg/cm².

(4) A molding resin composition according to the paragraphs (1) or (2),wherein said resin is an epoxy resin of which melt viscosity at 150° C.is not lower than 1 poise and not higher than 20 poises, and curedproduct of the composition has a glass transition temperature of 150° C.or above.

(5) A molding resin composition according to paragraph (4), wherein theproportion of the filler contained in the resin is not smaller than 60%by weight and not greater than 94% by weight based on the totalcomposition and the spiral flow of the composition is 20 inches or aboveas measured according to the standard of EMMI-1-66 at 175° C. under apressure of 70 kg/cm².

(6) A molding resin composition according to paragraph (1) or (2),wherein said resin is a compound having maleimide group.

(7) A molding resin according to paragraph (6), wherein the proportionof the filler contained in the resin is not smaller than 60% by weightand not greater than 94% by weight based on the total weight of thecomposition and the spiral flow of the composition is 20 inches or aboveas measured according to the standard of EMMI-1-66 at 175° C. under apressure of 70 kg/cm².

DETAILED DESCRIPTION OF THE INVENTION

The present invention is described in more detail below.

The globular powders which can be used in the present invention includesilica, alumina, aluminum nitride, silicon nitride, silicon carbide,siliceous sand, silica powder, talc, white carbon, aerosil,wollastonite, mica, clay, globular glass, globular metal and the like.From the viewpoint of thermal expansion coefficient and purity, globularpowders composed of fused silica powder, crystalline silica powder,alumina powder and the like are preferred.

As for the shape of the globular powder, a substantially globular shapewith an aspect ratio of from 1.0 to 1.2 having no sharp edge is enoughfor the purpose of the invention. Globular powders of which globularityis comparable to that of commercial globular silica powders prepared byflame spraying process or sol-gel process are preferable, and those ofwhich globularity is closer to true sphericity than that of thecommercial products are more preferable. When the globulizing treatmentis difficult to carry out, a globular powder can be produced also bypulverizing a starting material into a fine powder, adding a binder tothe fine powder, and forming the mixture into globular material by amechano-chemical process.

As for the shape of the fragmental powder, irregular shapes such asedged polyhedrons may be enough for the purpose of the invention. Amongthe powders of those shapes, fragmental powders of amorphous orcrystalline silica obtained by pulverizing natural quartz are preferred,and fused fragmental silica and the like are particularly preferred.

The globular powder used in the present invention consists of threegroups, namely components x, y and z. The mean particle diameters of thex, y and z components are not smaller than 0.1 μm and not greater than1.5 μm, not smaller than 2 μm and not greater than 15 μm, and notsmaller than 20 μm and not greater than 70 μm, respectively, andpreferably not smaller than 0.1 μm and not greater than 1 μm, notsmaller than 2 μm and not greater than 10 μm, and not smaller than 20 μmand not greater than 50 μm, respectively. If the mean particle diametersare out of the above-mentioned ranges, fluidity of the resin compositiondeteriorates to bring about an undesirable result. In the presentinvention, narrow dispersions of particle diameters are preferred, anddispersions close to monodispersion are particularly preferred.Accordingly, the x, y and z components are preferably those having beensubjected to a sieving treatment for the sake of uniformalizing theparticle diameters. As used in the present invention, the term "meanparticle diameter" is defined as a particle diameter at a weightaccumulation of 50% as determined through a particle size distributionmeasurement using a particle size distribution measuring apparatus suchas laser scattering type particle size distribution meter or the like.

The compounding ratios of the x, y and z components in the globularpowder are not smaller than 10% by volume and not greater than 24% byvolume, not smaller than 0.1% by volume and not greater than 36% byvolume and not smaller than 57% by volume and not greater than 76% byvolume, respectively, and preferably not smaller than 10% by volume andnot greater than 20% by volume, not smaller than 4% by volume and notgreater than 30% by volume and not smaller than 60% by volume and notgreater than 76% by volume, respectively, based on the total volume ofx, y and z components. If the compounding ratios of x, y and zcomponents are out of the above-mentioned ranges, fluidity of the resincomposition deteriorates to bring about an undesirable result.

In the present invention, the term "% by volume" means the volume ofcomponents x, y and z each which had been calculated by dividing theweight of components x, y and z each by the true specific gravitythereof.

Generally speaking, the apparent volume of a particulate material havinga particle size distribution varies with the method of packing thematerial into the vessel used in the measurement; and in the case ofmixing a plurality of different particulate materials, the apparentvolume of the mixture varies before and after the mixing. Accordingly,such "apparent volume" is not used in the present invention forcalculating "% by volume" of each component in the assembly ofparticles.

The fragmental particle (m component) used in the present invention hasa mean particle diameter of not smaller than 1 μm and not greater than70 μm, and preferably not smaller than 1 μm and not greater than 30 μm.The compounding ratio of the fragmental powder (m component) must be notsmaller than 1% by weight and not greater than 30% by weight based onthe total weight of x, y and z components and the fragmental powdercomponent m. If the amount of m component is smaller than the rangeprescribed above, the preventive effect on the occurrence of burr andflash (thin films of resin formed from exuded resin) which can be formedin some kinds of resin, in some sealing apparatuses and in some forms ofdie is small. If the amount of m component is greater than theabove-mentioned range, fluidity of resin composition is not good.

Preferably, the filler used in the present invention is sufficientlymixed previously. The mixing can be achieved by using an apparatus usinga rotor or air such as mixer, co-kneader and the like, an apparatus forvibrating, shaking or rotating a vessel, and the like. Recommendably,whether a filler has sufficiently been mixed (homogenized) or not ischecked by measuring particle size distribution of sample at differentpositions and examining their substantial equality. If necessary, thefiller may be pretreated with a coupling agent or a resin. As the methodof the pretreatment, a method of mixing using a solvent, followed bydistilling out the solvent, and a method of direct addition of thecoupling agent or resin to a filler, followed by a treatment using amixer can be referred to.

In the present invention, when an epoxy resin of which melt viscosity at150° C. is lower than 1 poise is used as the resin ingredient, thefiller is used preferably in an amount of not smaller than 83% by weightand not larger than 94% by weight and further preferably in an amount ofnot smaller than 88% by weight and not larger than 94% by weight basedon the total composition. If the amount of the filler is smaller thanthe range mentioned above, the effect of decreasing the moistureabsorption and thermal expansion coefficient due to the resin isinsufficient. If the amount of the filler is larger than theabove-mentioned range, no sufficient fluidity can be achieved.

Concrete examples of the epoxy resin of which melt viscosity at 150° C.is lower than 1 poise include the following:

the glycidyl ether compounds derived from trihydric or higher-hydricphenol compounds such as phloroglucin, tris(4-hydroxyphenyl)methane,1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, 1,3-bisbis(4-hydroxyphenyl)methyl)benzene, or 1,4-bisbis(4-hydroxyphenyl)methyl!benzene and the like, cyclic phenols such ascallixallene and the like;

glycidyl ether compounds of dihydric phenol compounds such as BispshenolA, Bisphenol F, hydroquinone, resorcin, dihydroxynaphthalene,bis(4-hydroxyphenyl)menthane, bis(4-hydroxyphenyl)dicyclopentane,4,4'-dihydroxybenzophenone, bis(4-hydroxyphenyl) ether,bis(4-hydroxy-3-methylphenyl) ether, bis(3,5-dimethyl-4-hydroxyphenyl)ether, bis(4-hydroxyphenyl) sulfide, bis(4-hydroxy-3-methylphenyl)sulfide, bis(3,5-dimethyl-4-hydroxyphenyl) sulfide, bis(4-hydroxyphenyl)sulfone, bis(4-hydroxy-3-methylphenyl) sulfone,bis(3,5-dimethyl-4-hydroxyphenyl) sulfone,1,1-bis(4-hydroxyphenyl)cyclohexane,1,1-bis(4-hydroxy-3-methylphenyl)cyclohexane,1,1-bis(3,5-dimethyl-4-hydroxyphenyl)cyclohexane,4,4'-dihydroxybiphenyl, 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl,bis(hydroxynaphthyl)methane, 1,1'-binaphthol,1,1'-bis(3-t-butyl-6-methyl-4-hydroxyphenyl)butane and the like;glycidyl ether compounds derived from halogenated bisphenols such asTetrabromobisphenol A and the like; and glycidyl ether compounds of thepolyhydric phenol compounds obtained through condensation of a phenolcompound and an aromatic carbonyl compound;

amine type epoxy resins derived from p-aminophenol, m-aminophenol,4-amino-m-cresol, 6-amino-m-cresol, 4,4'-diaminodiphenylmethane,3,3'-diaminodiphenylmethane, 4,4'-diaminodiphenyl ether,3,4'-diaminodiphenyl ether, 1,4-bis(4-aminophenoxy)benzene,1,4-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene,1,3-bis(3-amino-phenoxy)benzene, 2,2-bis(4-aminophenoxyphenyl)propane,p-phenylenediamine, m-phenylenediamine, 2,4-tolylenediamine,2,6-tolylenediamine, p-xylylenediamine, m-xylylenediamine,1,4-cyclohexanebis(methylamine), 1,3-cyclohexanebis(methylamine) and thelike;

glycidyl ester compounds derived from aromatic carboxylic acids such asp-oxybenzoic acid, m-oxybenzoic acid, terephthalic acid, isophthalicacid and the like; hydantoin type epoxy compounds derived from5,5-dimethylhydantoin and the like; alicyclic epoxy resins such as2,2-bis(3,4-epoxycyclohexyl)propane, 2,2-bis4-(2,3-epoxypropyl)cyclohexyl!propane, vinylcyclohexene dioxide,3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexanecarboxylate and the like;aliphatic epoxy resins obtained by oxidizing the double bonds inunsaturated hydrocarbon compounds such as polybutadiene and the like;N,N-diglycidylaniline; and the like.

One or more of these epoxy resins are used in the present invention.Among these epoxy resins, diglycidyl compounds of dihydroxynaphthalene,bis(4-hydroxyphenyl) ether, bis(3,5-dimethyl-4-hydroxyphenyl) sulfide,1,1-bis(4-hydroxy-3-methylphenyl)cyclohexane, 4,4'-dihydroxybiphenyl,4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenyl andbis(4-hydroxyphenyl)menthane, bis(4-hydroxyphenyl)dicyclopentane arepreferable from the viewpoint of viscosity, adhesive property andlowness in moisture absorption.

When an epoxy resin of which melt viscosity at 150° C. is not lower than1 poise and not higher than 20 poises is used in the present invention,the amount of the filler can be in the range of not smaller than 50% byweight and not larger than 95% by weight based on the total composition.If the amount of the filler is smaller than the above-mentioned range,known filler formulations can give a sufficient fluidity, so thatapplication of the present invention is meaningless. If the amount ofthe filler is larger than the above-mentioned range, fluidity of thecomposition is not good. From the viewpoint of making good use of thelow moisture absorption and low thermal expansion coefficient which thefiller originally has, the amount of the filler should be preferably inthe range of not smaller than 60% by weight and not larger than 94% byweight, and further preferably in the range of not smaller than 83% byweight and not larger than 91% by weight. When melt viscosity of theepoxy resin is 1 poise or higher, a sealed article of semi-conductorexhibiting excellent properties after cure while retaining a high Tg canbe obtained. When melt viscosity of the epoxy resin is higher than 20poises, it is difficult to add the filler in an amount enough forpreventing package crack or the components necessary for realizing highperformances with maintaining a sufficient fluidity, whereby the degreeof freeness in formulation decreases.

As such an epoxy resin, polyfunctional epoxy resins having two or moreepoxy groups in one molecule can be referred to. Concrete examples ofsuch epoxy resins include polyphenol type or polynaphthol type novolacresins obtained by reacting an aldehyde compound such as formaldehydeand the like with a phenol compound such as phenol, o-cresol, catecholand the like or a naphthol compound such as hydroxynaphthalene,dihydroxynaphthalene and the like; a trityl skeleton-containingpolyphenol compound obtained by condensing a phenol compound such asphenol, o-cresol, methyl-t-butylphenol or the like with an aromaticaldehyde compound such as hydroxybenzaldehyde or the like;polyaralkylphenol resins and polyaralkylnaphthol resins obtained byreacting xylylene dichloride or the like with a phenol compound such asphenol, o-cresol, catechol or a naphthol compound such ashydroxynaphthalene, dihydroxynaphthalene or the like; alicyclichydrocarbon-containing polyphenol resins and polynaphthol resinsobtained by reacting a phenol compound such as phenol, o-cresol,catechol or the like or a naphthol compound such as hydroxynaphthalene,dihydroxynaphthalene or the like with an unsaturated alicyclichydrocarbon such as dicyclopentadiene, limonene or the like; andglycidyl ether compounds of polyhydric phenols and polyhydric naphtholsobtained by condensing a phenol compound or a naphthol compound with anaromatic carbonyl compound; and

glycidyl ether compounds derived from a tri- or higher-hydric phenolcompound having a fundamental skeleton of phloroglucin,tris(4-hydroxyphenyl)methane, 1,1,2,2-tetrakis-(4-hydroxyphenyl)ethane,1,3-bis bis(4-hydroxyphenyl)methyl!benzene, 1,4-bisbis(4-hydroxyphenyl)methyl!benzene or the like; and glycidyl ethercompounds derived from cyclic phenol compounds such as callixallene orthe like. One or more of these epoxy resins are used in the presentinvention. Among these epoxy resins, preferred are the polyphenol typenovolac resins, trityl skeleton-containing polyphenol compounds,polyaralkylphenol resins, alicyclic hydrocarbon-containing polyphenolresins or the glycidyl ether compounds of polyhydric phenol compoundsand polyhydric naphthol compounds obtained by a condensation reaction ofan aromatic carbonyl compound with phenol compounds.

When the resin composition of the present invention contains an epoxyresin of which melt viscosity at 150° C. is not lower than 1 poise andnot higher than 20 poises as said resin ingredient, an epoxy resin ofwhich melt viscosity at 150° C. is lower than 1 poise may be added tothe composition, if desired, in addition to the above-mentioned epoxyresin for the purpose of regulating viscosity and improving propertiesof the epoxy resin composition.

As the epoxy curing agent used in the present invention, known curingagents can be used. Examples of the curing agent include polyphenol typeand polynaphthol type novolac resins obtained by reacting an aldehydecompound such as formaldehyde or the like with a phenol compound such asphenol, o-cresol, catechol or the like or a naphthol compound such ashydroxynaphthalene, dihydroxynaphthalene or the like; polyaralkylphenolresins and polyaralkylnaphthol resins obtained by reacting xylylenechloride or the like with a phenol compound such as phenol, o-cresol,catechol or the like or a naphthol compound such as hydroxynaphthalene,dihydroxynaphthalene or the like; alicyclic hydrocarbon-containingpolyphenol resins and polynaphthol resins obtained by reacting a phenolcompound such as phenol, o-cresol, catechol or the like or a naphtholcompound such as hydroxynaphthalene, dihydroxynaphthalene or the likewith an unsaturated alicyclic hydrocarbon such as dicyclopentadiene,limonene or the like; tri- or higher-hydric phenol compounds having afundamental skeleton of phloroglucin, tris(4-hydroxyphenyl)methane,1,1,2,2-tetrakis(4-hydroxyphenyl)ethane, 1,3-bisbis(4-hydroxyphenyl)methyl!benzene, 1,4-bisbis(4-hydroxyphenyl)methyl!benzene or the like; cyclic phenols such ascallixallene or the like; dihydric phenol compounds such as Bisphenol A,Bisphenol F, hydroquinone, resorcin, dihydroxynaphthalene,bis(4-hydroxyphenyl)ethane, bis(4-hydroxyphenyl)propane,bis(4-hydroxyphenyl)butane, bis(4-hydroxyphenyl)pentane,bis(4-hydroxyphenyl)hexane, 1,3,3-trimethyl-1-m-hydroxyphenylindan-5- or-7-ol, bis(4-hydroxyphenyl)menthane, bis(4-hydroxyphenyl)dicyclopentane,4,4'-dihydroxybenzophenone, bis(4-hydroxyphenyl) ether,bis(4-hydroxy-3-methylphenyl) ether, bis(3,5-dimethyl-4-hydroxyphenyl)ether, bis(4-hydroxyphenyl) sulfide, bis(4-hydroxy-3-methylphenyl)sulfide, bis(3,5-dimethyl-4-hydroxyphenyl) sulfide, bis(4-hydroxyphenyl)sulfone, bis(4-hydroxy-3-methylphenyl) sulfone,bis(3,5-dimethyl-4-hydroxyphenyl) sulfone,1,1-bis(4-hydroxyphenyl)cyclohexane,1,1-bis(4-hydroxy-3-methylphenyl)cyclohexane,1,1-bis(3,5-dimethyl-4-hydroxyphenyl)cyclohexane,4,4'-dihydroxybiphenyl, 4,4'-dihydroxy-3,3',5,5'-tetramethylbiphenylbis(hydroxynaphthyl)methane, 1,1'-binaphthol,1,1'-bis(3-t-butyl-6-methyl-4-hydroxyphenyl)butane and the like;halogenated bisphenols such as Tetrabromobisphenol A and the like;polyhydric phenols obtained by conden- sation reaction of a phenolcompound and an aromatic carbonyl compound; polycarboxylic acids such asmaleic acid, phthalic acid, nasic acid, methyl-tetrahydrophthalic acid,methyl-nasic acid and the like and anhydrides thereof; polyaminecompounds such as diaminodiphenylmethane, diaminodiphenyl sulfone,diaminodiphenyl ether, phenylenediamine, diaminodicyclohexylmethane,xylylene diamine, tolylene diamine, diaminocyclohexane,dichlorodiaminodiphenylmethane (including isomers), ethylene diamine,hexamethylenediamine and the like; and active hydrogen-containingcompounds which can react with epoxy group such as dicyandiamide,tetramethylguanidine and the like. Among these compounds, phenol typenovolac resins, phenol type aralkyl resins, naphthol type aralkylresins, alicyclic hydrocarbon-containing polyphenol resins and alicyclichydrocarbon-containing polynaphthol resins are preferred from theviewpoint of curing performance and moisture resistance.

In the resin composition of the present invention, the compounding ratioof the curing agent to the epoxy resin is preferably in the range offrom 0.7 equivalent to 1.2 equivalents, and further preferably oneequivalent, per equivalent of epoxy resin. If the compounding ratio isfar distant from one equivalent, moisture resistance and curingperformance deteriorate to bring about undesirable results.

Next, the method for heat-curing the epoxy resin composition of theinvention is mentioned below. The composition can be cured easily in ashort period of time by the use of a curing accelerator. Particularlywhen the composition is used as a sealing material, the use of a curingaccelerator is indispensably necessary. Non-limitative examples of suchcatalysts (curing accelerators) include organic phosphine compounds suchas triphenylphosphine, tri-4-methylphenylphosphine,tri-4-methoxyphenylphosphine, tributylphosphine, trioctylphosphine,tri-2-cyanoethyl-phosphine and the like; organic phosphonium salts suchas tetraphenylphosphonium tetraphenylborate and the like; tertiaryamines such as tributylamine, triethylamine,1,8-diazabicyclo(5,4,0)undecene-7, triamylamine and the like; quaternaryammonium salts such as benzyltrimethylammonium chloride,benzyltrimethylammonium hydroxide, triethylammonium tetraphenylborateand the like; imidazoles; boron trifluoride complexes; transition metalacetylacetonates; and radical initiators such as benzoyl peroxide,di-t-butyl peroxide, dicumyl peroxide, lauroyl peroxide, acetylperoxide, methyl ethyl ketone peroxide, cyclohexanone peroxide, t-butylhydroperoxide, azobisisobutyronitrile and the like. Among these curingaccelerators, particularly preferred are organic phosphine compounds andimidazoles and salts thereof (concretely speaking,tetraphenylphosphonium tetraphenyl-borate, 4-methylimidazoletetraphenylborate and the like), and triethylammonium tetraphenylborate.

The curing accelerator is used in an amount of from 0.1 to 10 parts byweight and preferably from 0.5 part to 3 parts by weight per 100 partsby weight of epoxy resin. If the amount of curing accelerator is smallerthan the above-mentioned range, the molding is difficult to complete ina short period of time, which reduced the productivity of molded articleper unit time. If the amount of curing accelerator is larger than theabove-mentioned range, the curability at high temperature excessivelyincreases, which brings about troubles such as difficulty in operationand decrease in storage stability of compound.

If desired, a known polymerization inhibitor may be used in combinationwith the above-mentioned ingredients for the purpose of controlling thecuring velocity. Examples of said polymerization inhibitor includephenol compounds such as 2,6-di-t-butyl-4-methylphenol,2,2'-methylenebis(4-ethyl-6-t-butylphenol),4,4'-methylenebis(2,6-di-t-butylphenol),4,4'-thiobis(3-methyl-6-t-butylphenol), hydroquinone monomethyl etherand the like; polyhydric phenol compounds such as hydroquinone,catechol, p-t-butylcatechol, 2,5-di-t-butylhydroquinone,methylhydroquinone, t-butylhydroquinone, pyrogallol and the like;phenothiazine compounds such as phenothiazine, benzophenothiazine,acetamidophenothiazine and the like; and N-nitrosamine compounds such asN-nitrosodiphenylamine, N-nitrosodimethylamine and the like.

When a compound having maleimide group is used in the present invention,the filler can be used in an amount of not smaller than 50% by weightand not larger than 95% by weight based on the total composition. If theamount of said compound having maleimide group is smaller than theabove-mentioned range, sufficient fluidity can be achieved according toknown formulation of filler, so that application of the presentinvention is meaningless. If the amount of the compound exceeds theabove-mentioned range, fluidity is not good. From the viewpoint ofmaking good use of the low moisture absorption and low thermal expansioncoefficient which the filler originally has, the amount of the filler ispreferably in the range of not smaller than 60% by weight and not largerthan 94% by weight, and preferably not smaller than 81% by weight andnot larger than 92% by weight.

Concrete examples of the maleimide compound used in the presentinvention are as follows:

aromatic monomaleimides such as phenylmaleimide, methylphenylmaleimide,maleimido-benzoic acid, hydroxyphenylmaleimide, chlorophenylmaleimide,bromophenylmaleimide, tribromophenylmaleimide, phenoxyphenyl-maleimide,maleimidophenoxyphenylmenthane, maleimidophenoxy-phenyldicyclopentaneand the like; aliphatic monomaleimides such as octylmaleimide,cyclohexylmaleimide and the like;

aromatic bismaleimides having two benzene rings in one molecule such asN,N'-4,4'-diaminodiphenylmethane-bismaleimide,N,N'-bis(4-amino-3,5-dimethylphenyl)methanebismaleimide,N,N'-bis(4-amino-3-ethyl-5-methylphenyl)methanebismaleimide,N,N'-bis(4-amino-3,5-diethylphenyl)methanebismaleimide,N,N'-4,4'-diaminodiphenylether-bismaleimide,N,N'-3,4'-diaminodiphenylether-bismaleimide,N,N'-4,4'-diaminodiphenylsulfide-bismaleimide,N,N'-4,4'-diaminodiphenylsulfone-bismaleimide and the like;

aromatic bismaleimides having three or more benzene rings in onemolecule such as N,N'-2,2'-bis4-(4-aminothio-phenoxy)phenyl!propane-bismaleimide,N,N'-4,4'-bis(4-aminophenoxy)benzophenone-bismaleimide,N,N'-1,3-bis(4,4'-aminophenoxy)benzene-bismaleimide,N,N'-1,3-bis(3,3'-aminophenoxy)benzene-bismaleimide,N,N'-1,4-bis(4,4'-aminophenoxy)benzene-bismaleimide,N,N'-1,4-bis(3,3'-aminophenoxy)benzene-bismaleimide,N,N'-4,4'-bis(4-aminophenoxy)biphenyl-bismaleimide,N,N'-4,4'-bis(3-aminophenoxy)biphenyl-bismaleimide,N,N'-4,4'-bis(4-aminophenoxy)-3,3'5,5'-tetramethylbiphenyl-bismaleimide,N,N'-4,4'-bis(3-aminophenoxy)-3,3',5,5'-tetramethylbiphenyl-bismaleimide,N,N'-1,1-bis 4-(4-aminophenoxy)phenyl!-cyclohexane-bismaleimide,N,N'-1-phenyl-1,1-bis(4-(4-aminophenoxy)phenyl!methane-bismaleimide,N,N'-1,4-bis bis(4-aminophenyl)methyl!benzene-bismaleimide, N,N'-1,1-bis4-(4-aminophenoxy)phenyl!cyclohexane-bismaleimide, N,N'-2,2-bis4-(4-aminophenoxy)phenyl!methane-bismaleimide, N,N'-2,2-bis4-(4-aminophenoxy)phenyl!propane-bismaleimide, N,N'-2,2-bis4-(3-aminophenoxy)phenyl!propane-bismaleimide, N,N'-2,2-bis3-methyl-4-(aminophenoxy)phenyl!propane-bismaleimide, N,N'-2,2-bis4-(4-aminophenoxy)phenyl!propane-bismaleimide,N,N'-1,1,1,3,3,3-hexafluoro-2,2-bis4-trifluoromethyl-4-(aminophenoxy)phenyl!propane-bismaleimide,N,N'-1,1,1,3,3,3-hexafluoro-2,2-bis4-(4-aminophenoxy)phenyl!propane-bismaleimide, N,N'-1,1-bis4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl!butane-bismaleimide,N,N'-1,1-bis4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl!propane-bismaleimide,N,N'-1,1-bis4-(4-aminopaminophenoxy)-3-t-butyl-6-methylphenyl!ethane-bismaleimide,N,N'-1,1-bis4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl!methane-bismaleimide,N,N'-1,1,1,3,3,3-hexafluoro-2,2-bis4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl!propane-bismaleimide and thelike;

aromatic maleimides having three or more maleimide groups in onemolecule such as tris 4-(4-maleimidophenoxy)-phenyl!methane,1,1,2,2-tetrakis(4-maleimidophenyl)ethane,1,1,2,2-tetrakis(4-maleimidophenylmethyl)benzene, aniline novolac resinprepared from aniline and formaldehyde, aralkylaniline resin preparedfrom aniline and a xylene derivative such as α,α'-xylene dichloride, andthe like;

naphthalene ring-containing aromatic bismaleimides such asN,N'-diaminonaphthalene-bismaleimide,N,N'-2,7-bis(4,4'-aminophenoxy)naphthalene-bismaleimide,N,N'-2,7-bis(3,3'-aminophenoxy)naphthalene-bismaleimide,N,N'-2,7-bis(3,4'-aminophenoxy)naphthalene-bismaleimide,N,N'-1,6-bis(4,4'-aminophenoxy)naphthalene-bismaleimide,N,N'-1,6-bis(3,3'-aminophenoxy)naphthalene-bismaleimide,N,N'-1,6-bis(3,4'-aminophenoxy)naphthalene and the like;

alicyclic skeleton-containing bismaleimides such as N,N'-bis4-(4-aminophenoxy)phenyl!menthane-bismaleimide, N,N'-bis2-(4-aminophenoxy)phenyl!methane-bismaleimide, N,N'-bis4-(3-aminophenoxy)phenyl!menthane-bismaleimide, N,N'-bis2-(3-aminophenoxy)phenyl!menthane-bismaleimide, N,N'-bis4-(4-aminophenoxy)-3-methylphenyl!menthane-bismaleimide,N,N'-bis(4-(4-aminophenoxy)-3,5-dimethylphenyl!menthane-bismaleimide,N,N'-bis4-(4-aminophenoxy)-3-butyl-6-methylphenyl!menthane-bismaleimide,N,N'-bis4-(4-amino-5-methylphenoxy)-3-methylphenyl!menthane-bismaleimide,N,N'-bis4-(4-amino-5-methylphenoxy)-3,5-dimethylphenyl!methane-bismaleimide,N,N'-bis4-(4-amino-5-methylphenoxy)-3-butyl-6-methylphenyl!menthane-bismaleimide,N,N'-bis 2-(4-aminophenoxy)-3-methylphenyl!menthane-bismaleimide,N,N'-bis 4-(4-aminophenoxy)phenyl!dicyclopentane-bismaleimide, N,N'-bis2-(4-aminophenoxy)phenyl!dicyclopentane-bismaleimide, N,N'-2-(4-aminophenoxy)phenyl!-4-(4-aminophenoxy)phenyl!-dicyclopentane-bismaleimide, N,N'-bis4-(3-aminophenoxy)-phenyl!dicyclopentane-bismaleimide, N,N'-bis2-(3-aminophenoxy)phenyl!-dicyclopentane-bismaleimide, N,N'-2-(3-aminophenoxy)phenyl!-4-(3-aminophenoxy)phenyl!dicyclopentane-bismaleimide, N,N'-bis4-(4-aminophenoxy)-3-methylphenyl!-dicyclopentane-bismaleimide, N,N'-bis4-(4-aminophenoxy)-3,5-dimethylphenyl!-dicyclopentane-bismaleimide,N,N'-bis4-(4-aminophenoxy)-3-butyl-6-methylphenyl!dicyclopentane-bismaleimide,N,N'-bis4-(4-amino-5-methylphenoxy)-3-methylphenyl!dicyclopentane-bismaleimide,N,N'-bis4-(4-amino-5-methylphenoxy)-3,5-dimethylphenyl!dicyclopentane-bismaleimide,N,N'-bis4-(4-amino-5-methylphenoxy)-3-butyl-6-methylphenyl!dicyclopentane-bismaleimide,N,N'-bis 2-(4-aminophenoxy)-3-methylphenyl!-dicyclopentane-bismaleimide,N,N'- 2-(4-aminophenoxy)-3-methylphenyl!-4-(4-aminophenoxy)-3-methylphenyl!-dicyclopentane-bismaleimide, and thelike; and

silicone type bismaleimides such asN,N'-ω,ω-bis(2-aminoethyl)polydimethylsiloxane-bismaleimide,N,N'-ω,ω-bis(3-aminopropyl)polydimethylsiloxane-bismaleimide,N,N'-ω,ω-bis(2-aminopropyl)polydiphenylsiloxane-bismaleimide,N,N'-bis(4-aminophenyl)polydimethylsiloxane-bismaleimide,N,N'-ω,ω-bis(aminophenoxyphenylpropyl)polydimethylsiloxane-bismaleimide,N,N'-ω,ω'-bis(aminophenylpropyl)polydimethyl-siloxane-bismaleimide,N,N'-1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane-bismaleimide,N,N'-1,3-bis(3-aminopropyl)-1,1,3,3-tetraphenyldisiloxane-bismaleimide,and the like.

Among these bismaleimide compounds,N,N'-4,4'-diaminodiphenylmethane-bismaleimide and the ether typebismaleimides such asN,N'-2,7-bis(4-aminophenoxy)naphthalene-bismaleimide,- N,N'-1,1-bis4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl!butane-bismaleimide,N,N'-2,2-bis 4-(4-aminophenoxy)phenyl!-propane-bismaleimide,N,N'-4,4'-bis 3-aminophenoxy)biphenyl-bismaleimide, N,N'-bis4-(4-aminophenoxy)phenyl!menthane-bismaleimide and the like arepreferred because of their excellence in general balance betweenproperties of cured product, inexpensiveness, etc.

To the imide resin used in the present invention, the above-mentionedepoxy resin of which melt viscosity is lower than 1 poise and the epoxyresin of which melt viscosity is not lower than 1 poise and not higherthan 20 poises may both be added for the purpose of controllingviscosity and improving properties, if desired.

The compounding ratio of the epoxy curing agent to the epoxy resin ispreferably from 0.7 equivalent to 1.2 equivalents and preferably oneequivalent per equivalent of epoxy resin. If the compounding ratio isextremely distant from one equivalent, moisture resistance, curingcharacteristics, etc. deteriorate to bring about an undesirable result.

The epoxy resin is added to the maleimide compound in an amount of from2 to 900 parts by weight and preferably from 5 to 200 parts by weight,per 100 parts by weight of the maleimide compound. If the amount of theepoxy resin is smaller than the above-mentioned range, the maleimidecompound and the filler are not easily kneaded uniformly, whichdecreases the adhesion of the compound to frame and semi-conductorelements. If the amount of the epoxy resin is larger than theabove-mentioned range, Tg of cured product decreases, and no sufficientheat resistance can be achieved.

Next, the method for heat-curing the imide resin composition of thepresent invention will be mentioned. The imide resin composition of thepresent invention can be cured by the use of a curing accelerator easilyin a short period of time. Particularly when the imide resin compositionof the invention is used as a sealing material, the use of a curingaccelerator is indispensably necessary. Non-limitative examples of suchcatalysts (curing accelerators) include organic phosphine compounds suchas triphenylphosphine, tri-4-methylphenylphosphine,tri-4-methoxyphenylphosphine, tributylphosphine, trioctylphosphine,tri-2-cyanoethyl-phosphine and the like; organic phosphonium salts suchas tetraphenylphosphonium tetraphenylborate and the like; tertiaryamines such as tributylamine, triethylamine,1,8-diazabicyclo(5,4,0)undecene-7, triamylamine and the like; quaternaryammonium salts such as benzyltrimethylammonium chloride,benzyltrimethylammonium hydroxide, triethylammonium tetraphenylborateand the like; imidazoles; boron trifluoride complexes; transition metalacetylacetonates; and radical initiators such as benzoyl peroxide,di-t-butyl peroxide, dicumyl peroxide, lauroyl peroxide, acetylperoxide, methyl ethyl ketone peroxideperoxide, t-bue peroxide, t-butylhydroperoxide, azobisisobutyronitrile and the like. Among these curingaccelerators, particularly preferred are organic phosphine compounds andimidazoles and salts thereof (concretely speaking,tetraphenylphosphonium tetraphenyl-borate, 4-methylimidazoletetraphenylborate and the like), and triethylammonium tetraphenylborate.

The curing accelerator is used in an amount of from 0.1 to 10 parts byweight and preferably from 0.3 part to 5 parts by weight per 100 partsby weight of imide resin. If the amount of curing accelerator is smallerthan the above-mentioned range, the molding is difficult to complete ina short period of time, which reduced the productivity of molded articleper unit time. If the amount of curing accelerator is larger than theabove-mentioned range, the curability at high temperature excessivelyincreases, which causes troubles such as difficulty in operation anddecrease in storage stability of compound.

If desired, a known polymerization inhibitor may be used in combinationwith the above-mentioned ingredients for the purpose of controlling thecuring velocity. Examples of said polymerization inhibitor includephenol compounds such as 2,6-di-t-butyl-4-methylphenol,2,2'-methylenebis(4-ethyl-6-t-butylphenol).4,4'-methylenebis(2,6-di-t-butylphenol),4,4'-thiobis(3-methyl-6-t-butylphenol), hydroquinone monomethyl etherand the like; polyhydric phenol compounds such as hydroquinone,catechol, p-t-butylcatechol, 2,5-di-t-butyl-hydroquinone,methylhydroquinone, t-butylhydroquinone, pyrogallol and the like;phenothiazine compounds such as phenothiazine, benzophenothiazine,acetamidophenothiazine and the like; and N-nitrosamine compounds such asN-nitrosodiphenylamine, N-nitrosodimethylamine and the like.

If desired, an alkenyl group-containing compound may be added to theimide resin composition of the present invention for the purpose ofobtaining a sealing material having good moldability without lowering Tgof the composition or for providing reactive sites for siliconemodification. Concrete examples of said alkenyl group-containingcompound include polyphenol type or polynaphthol type novolac resinsobtained by reacting a phenol compound such as phenol, o-cresol,catechol or the like or a naphthol compound such as hydroxynaphthalene,dihydroxynaphthalene or the like with an aldehyde compound such asformaldehyde or the like; trityl skeleton-containing polyphenolcompounds obtained by a condensation reaction of a phenol compound suchas phenol, o-cresol, methyl-t-butylphenol or the like and an aromaticaldehyde compound such as hydroxybenzaldehyde or the like;polyaralkylphenol resins and polyaralkylnaphthol resins obtained byreacting xylylene dichloride or the like with a phenol compound such asphenol, o-cresol, catechol or the like or a naphthol compound such ashydroxynaphthalene, dihydroxynaphthalene or the like; alicyclichydrocarbon-containing polyphenol resins and polynaphthol resinsobtained by reacting a phenol compound such as phenol, o-cresol,catechol or the like or a naphthol compound such as hydroxynaphthalene,dihydroxynaphthalene or the like with an unsaturated alicyclichydrocarbon compound such as dicyclopentadiene, limonene or the like;and the compounds prepared by partially allyl-etherifying the hydroxylgroups of polyphenol compounds such as polyhydric phenols, polyhydricnaphthols or the like obtained through a condensation reaction of aphenol compound or a naphthol compound and an aromatic carbonylcompound. The content of the allyl ether is from 2 to 80% based on thehydroxyl group of the polyphenol compound.

To the imide resin composition of the present invention, an aminocompound may be added, if desired, for the purpose of improvingstrengths and toughness. Examples of said amino compound include thecompounds in which the maleimido group of the above-mentioned concreteexamples of maleimide compound is replaced with an amino group. Forexample, 4,4'-diaminodiphenylmethane can be referred to in place of theN,N'-4,4'-diaminodiphenylmethane-bismaleimide.

As the resins which can be used in the present invention, thermoplasticresins and thermosetting resins can be referred to. Among these resins,semiconductor-sealing resins are preferred because they can be loadedwith a high percentage of filler, and thermosetting resins, particularlyepoxy resin and imide resin, are further preferred.

As the resins other than epoxy resin and imide resin which can be usedin the present invention, the following can be referred to.

Thus, as thermosetting resins, resins having unsaturated group such asacrylic acid group, methacrylic acid group, vinylbenzyl group and thelike; resins having isocyanato group; resins obtained by Diels alderreaction such as the resin prepared from benzocyclobutene and anunsaturated bond-containing compound, and the like; resins obtained byreacting a silicon hydride-containing siloxane with an unsaturatedbond-containing compound in the presence of a platinum catalyst; and thelike can be referred to.

As thermoplastic resins, heat-resistant thermoplastic resins such astotally aromatic polyesters, polyamide-imides, polyimides,polyetheromides, polyester-sulfones, polyether-ether ketones, and thelike can be referred to.

Apart from the above, a demolding agent such as natural waxes, syntheticwaxes, higher aliphatic acids and metallic salts thereof, paraffins andthe like; a colorant such as carbon black and the like; asurface-treating agent such as silane coupler and the like; may be addedto the resin composition of the present invention, if desired. Further,a flame retardant such as antimony trioxide, a phosphorus compound, abrominated epoxy resin or the like may also be added. From the viewpointof flame-retarding effect, brominated epoxy resin is particularlyeffective.

Further, an elastomer may be added or previously reacted for the purposeof lowering stress. Concrete examples of the elastomer include additivetype and reaction type elastomers such as polybutadiene,butadiene-acrylonitrile copolymer, silicone rubber, silicone oil and thelike.

The resin composition obtained in the above-mentioned manner can be madeinto a compound by melting and homogenizing it with usual mixing orkneading means such as roll, co-kneader or the like.

In sealing an electronic part such as semi-conductor by the use of theresin composition of the present invention, the composition is cured andmolded according to hitherto known molding process such as transfermolding, compression molding, injection molding or the like.

As one index indicating the fluidity of molding resin composition,"spiral flow" can be referred to. A spiral flow of 20 inches or moremeans that the tip of cured product of a molding resin composition hasreached a point 20 inches or farther distant from the starting pointwhen measured according to the standard of EMMI-1-66 at 175° C. under apressure of 70 kg/cm², provided that EMMI is abbreviation from EpoxyMolding Materials Institute, which is a standard of American PlasticIndustry Association. If spiral flow is smaller than 20 inches, thereoccurs a problem of incomplete loading of compound into die so far asthe general transfer molding process is adopted, which brings about adifficulty that a molded article can be obtained only by using anexcessive amount of compound for every shot and carrying out the moldingat a high pressure. Further, if spiral flow is small, the number ofarticles in one die which can be molded in one shot decreases, whichleads to a decrease in productivity per unit time or an industrialdisadvantage. On the other hand, if spiral flow is great, the number ofarticles per shot increases and, in addition, special resin ingredientsand modifying agents necessary for improving performances, which cannotbe used under usual conditions because they increase the viscosity,become usable, and the scope of adoptable formulation becomes broader.As above, in a molding resin composition, ensuring a sufficient spiralflow gives a great merit to practical use.

EXAMPLES

Next, examples of the present invention are shown below in no limitativeway. In the examples, the methods for evaluation of molded products wereas mentioned below.

Spiral flow: Spiral flow was measured according to the standard ofEMMI-1-66 at 175° C. under a pressure of 70 kg/cm² ; the result ispresented in term of inches.

Glass transition temperature (Tg) and thermal expansion coefficient:Measured with Thermo-mechanical Analyzer (SHIMADZU DT-30).

Bending strength: Measured according to JIS K-6911 with InstronAll-purpose Material Testing Machine (SHIMADZU IS-10T).

Water absorption: In a constant temperature-constant humidity bath(TABAI PR-2), a package sealing a simulative element was examined forchange in weight at 85° C./85% RH.

Crack resistance test: Eight packages each mounting a simulative elementwere allowed to absorb water at 85° C., at 85% RH, for 72 hours, afterwhich the packages were immediately dipped in a solder bath kept at 240°C. for 30 seconds. The occurrence of package crack was examined.

Moldability: Regarding moldability, appearance of molded article,including flashes and surface irregularities, was evaluated andexpressed in three stages (∘, Δ and x). ∘ means that there is nopractical problem, Δ means that the article is inferior to ∘ although itis usable, and x means that the article is practically unusable.

Referential Examples 1-20

Using globular silicas and fragmental fused silicas of which meanparticle diameters and properties were as shown in Table 1, compoundingwas carried out at the ratios (% by volume) shown in Tables 2 and 3, andthe compounded mixtures thus obtained were thoroughly homogenized toobtain the fillers of Referential Examples 1-20. The particle sizedistribution was measured with Laser Scattering Particle SizeDistribution Meter (Master Sizer MS-20, manufactured by Malvern Co.),and the particle diameter at a weight accumulation of 50% was taken asmean particle diameter shown in Table 1.

                                      TABLE 1                                     __________________________________________________________________________          Mean Specific                                                                          Electro-                                                                          Fe.sup.++                                                        particle                                                                           surface                                                                           conduc-                                                                           ion Na.sup.+                                                                          Cl.sup.-                                                 diameter                                                                           area                                                                              tivity                                                                            content                                                                           ion ion                                                Silica                                                                              (μm)                                                                            (m.sup.2 /g)                                                                      (μS/cm)                                                                        (ppm)                                                                             (ppm)                                                                             (ppm)                                                                             Maker                                          __________________________________________________________________________    Globular                                                                            0.4  15  13  30  5   5   Tatsumori                                      silica-1   or more                                                                           or less                                                                           or less                                                                           or less                                                                           or less                                                                           K.K.                                           Globular                                                                            0.7  14  10  30  5   5   Tokuyama                                       silica-2       or less                                                                           or less                                                                           or less                                                                           or less                                                                           Soda K.K.                                      Globular                                                                            4.9  3   5   30  2   2   Nippon                                         silica-3       or less                                                                           or less                                                                           or less                                                                           or less                                                                           Kagaku K.K.                                    Globular                                                                            8.0  1.8 3   20  2   2   Tokuyama                                       silica-4       or less                                                                           or less                                                                           or less                                                                           or less                                                                           Soda K.K.                                      Globular                                                                            10.7 1.5 3   15  5   2   Denki                                          silica-5       or less                                                                           or less                                                                           or less                                                                           or less                                                                           Kagaku K.K.                                    Globular                                                                            28.7 0.5 3   20  2   2   Tokuyama                                       silica-6       or less                                                                           or less                                                                           or less                                                                           or less                                                                           Soda K.K.                                      Globular                                                                            40.4 0.5 3   20  2   2   Tokuyama                                       silica-7       or less                                                                           or less                                                                           or less                                                                           or less                                                                           Soda K.K.                                      Fragmental                                                                          5.3  5.6 2.8 15  4   2   Denki                                          fused              or less                                                                           or less                                                                           or less                                                                           Kagaku K.K.                                    silica-1                                                                      Fragmental                                                                          13.0 5.0 1.8 10  2   1   Denki                                          fused      or less or less                                                                           or less                                                                           or less                                                                           Kagaku K.K.                                    silica-2                                                                      __________________________________________________________________________

                                      TABLE 2                                     __________________________________________________________________________               Formulation                                                                   Referential Example                                                Silica     1  2  3  4  5  6  7   8   9   10                                   __________________________________________________________________________    Globular silica-1                                                                        -- -- -- -- -- 12%                                                                              --  13.5%                                                                             10.8%                                                                             10.8%                                Globular silica-2                                                                        16%                                                                              18%                                                                              20%                                                                              15%                                                                              18%                                                                              -- 16.2%                                                                             --  --  --                                   Globular silica-3                                                                        -- -- -- -- -- 20%                                                                              --  25.2%                                                                             18% 18%                                  Globular silica-4                                                                        12%                                                                              10%                                                                              10%                                                                              24%                                                                              8% --  9% --  --  --                                   Globular silica-6                                                                        72%                                                                              72%                                                                              70%                                                                              -- -- -- 64.8%                                                                             51.3%                                                                             --  --                                   Globular silica-7                                                                        -- -- -- 61%                                                                              74%                                                                              68%                                                                              --  --  61.2%                                                                             61.2%                                Fragmental fused silica-1                                                                -- -- -- -- -- .--                                                                              10% 10% 10% --                                   Fragmental fused silica-2                                                                -- -- -- -- -- -- --  --  --  10%                                  __________________________________________________________________________

                                      TABLE 3                                     __________________________________________________________________________               Formulation                                                                   Referential Example                                                Silica     11 12 13 14 15 16 17 18 19 20                                      __________________________________________________________________________    Globular silica-1                                                                        -- -- -- -- -- -- -- -- -- --                                      Globular silica-2                                                                         3%                                                                               5%                                                                               8%                                                                               8%                                                                              12%                                                                              14%                                                                               8%                                                                              28%                                                                              28%                                                                               5%                                     Globular silica-3                                                                        -- -- -- -- -- -- -- -- -- --                                      Globular silica-4                                                                        10%                                                                              19%                                                                              28%                                                                              11%                                                                               4%                                                                               5%                                                                              42%                                                                              10%                                                                              20%                                                                               2%                                     Globular silica-6                                                                        87%                                                                              76%                                                                              64%                                                                              81%                                                                              -- -- 50%                                                                              62%                                                                              52%                                                                              --                                      Globular silica-7                                                                        -- -- -- -- 84%                                                                              81%                                                                              -- -- -- 93%                                     Fragmental fused silica-1                                                                -- -- -- -- -- -- -- -- -- --                                      Fragmental fused silica-2                                                                -- -- -- -- -- -- -- -- -- --                                      __________________________________________________________________________

Examples 1-10 and Comparative Examples 1-10

As an epoxy resin, 4,4'-hydroxy-3,3',5,5'-tetramethylbiphenyl glycidylether (manufactured by Sumitomo Chemical Industry Co. Ltd.) having amelt viscosity of 0.1 poise/150° C. was used. As a curing agent, phenolnovolac (trade name Tamanol 759, manufactured by Arakawa Kagaku Co.) wasused. As a curing accelerator, triphenylphosphine was used. As ademolding agent, carnauba wax was used. As a coupler (coupling agent),SH-6040 (trade name, manufactured by Toray Dow Corning Silicone Co.) wasused. Each of the fillers of Referential Examples 1-20 was compoundedwith the above-mentioned ingredients according to the formulations (g)shown in Tables 4 and 5, heated and kneaded on rolls, and molded bymeans of a press. Then, the molded product was post-cured in an oven at180° C. for 5 hours to obtain a cured product. On the cured product thusobtained, glass transition temperature, water absorption, bendingstrength and moldability were measured. The results are shown in Tables4 and 5.

                                      TABLE 4                                     __________________________________________________________________________    Ex. 1      Ex. 2                                                                              Ex. 3                                                                              Ex. 4                                                                              Ex. 5                                                                              Ex. 6                                                                              Ex. 7                                                                              Ex. 8                                                                              Ex. 9                                                                              Ex. 10                     __________________________________________________________________________    Formulation                                                                   Filler                                                                              1399.5                                                                             --   --   --   --   --   --   --   --   --                         (Ref. Ex. 1)                                                                  Filler                                                                              --   1399.5                                                                             --   --   --   --   --   --   --   --                         (Ref. Ex. 2)                                                                  Filler                                                                              --   --   1399.5                                                                             --   --   --   --   --   --   --                         (Ref. Ex. 3)                                                                  Filler                                                                              --   --   --   1399.5                                                                             --   --   --   --   --   --                         (Ref. Ex. 4)                                                                  Filler                                                                              --   --   --   --   1399.5                                                                             --   --   --   --   --                         (Ref. Ex. 5)                                                                  Filler                                                                              --   --   --   --   --   1399. 5                                                                            --   --   --   --                         (Ref. Ex. 6)                                                                  Filler                                                                              --   --   --   --   --   --   1399.5                                                                             --   --   --                         (Ref. Ex. 7)                                                                  Filler                                                                              --   --   --   --   --   --   --   1399.5                                                                             --   --                         (Ref. Ex. 8)                                                                  Filler                                                                              --   --   --   --   --   --   --   --   1399.5                                                                             --                         (Ref. Ex. 9)                                                                  Filler (Ref.                                                                        --   --   --   --   --   --   --   --   --   1399.5                     Ex. 10)                                                                       Epoxy resin                                                                         100  100  100  100  100  100  100  100  100  100                        Curing                                                                              55.5 55.5 55.5 55.5 55.5 55.5 55.5 55.5 55.5 55.5                       Agent                                                                         Accelerator                                                                         1.5  1.5  1.5  1.5  1.5  1.5  1.5  1.5  1.5  1.5                        Coupler                                                                             2    2    2    2    2    2    2    2    2    2                          Demolding                                                                           1.78 1.78 1.78 1.78 1.78 1.78 1.78 1.78 1.78 1.78                       agent                                                                         Properties                                                                    Moldability                                                                         Δ                                                                            Δ                                                                            ∘                                                                      ∘                                                                      Δ                                                                            Δ                                                                            ∘                                                                      ∘                                                                      ∘                                                                      ∘              Spiral flow                                                                         31.5 32.0 32.2 36.1 31.1 40.5 26.5 30.5 42.8 40.5                       (inches)                                                                      Tg (°C.)                                                                     126  125  124  125  125  131  129  127  127  125                        Heat expan-                                                                         0.63 0.56 0.63 0.61 0.63 0.64 0.67 0.62 0.62 0.65                       sion coeff.                                                                   (×10.sup.5 ° C..sup.-1)                                          Bending                                                                             12.2 11.9 13.4 13.1 10.7 14.6 10.1 13.3 15.0 12.9                       strength                                                                      (kg/mm.sup.2)                                                                 Water 0.155                                                                              0.162                                                                              0.162                                                                              0.158                                                                              0.171                                                                              0.150                                                                              0.177                                                                              0.152                                                                              0.130                                                                              0.164                      absorption                                                                    (72 h) (%)                                                                    Crack 0/8  0/8  0/8  0/8  0/8  0/8  0/8  0/8  0/8  0/8                        resistance                                                                    test                                                                          __________________________________________________________________________

                                      TABLE 5                                     __________________________________________________________________________    Comp.     Comp.                                                                             Comp.                                                                             Comp.                                                                             Comp.                                                                             Comp.                                                                             Comp.                                                                             Comp.                                                                             Comp.                                                                             Comp.                               Ex. 1     Ex. 2                                                                             Ex. 3                                                                             Ex. 4                                                                             Ex. 5                                                                             Ex. 6                                                                             Ex. 7                                                                             Ex. 8                                                                             Ex. 9                                                                             Ex. 10                              __________________________________________________________________________    Formulation                                                                   Filler (Ref.                                                                        1399.5                                                                            --  --  --  --  --  --  --  --  --                                  Ex. 11)                                                                       Filler (Ref.                                                                        --  1399.5                                                                            --  --  --  --  --  --  --  --                                  Ex. 12)                                                                       Filler (Ref.                                                                        --  --  1399.5                                                                            --  --  --  --  --  --  --                                  Ex. 13)                                                                       Filler (Ref.                                                                        --  --  --  1399.5                                                                            --  --  --  --  --  --                                  Ex. 14)                                                                       Filler (Ref.                                                                        --  --  --  --  1399.5                                                                            --  --  --  --  --                                  Ex. 15)                                                                       Filler (Ref.                                                                        --  --  --  --  --  1399.5                                                                            --  --  --  --                                  Ex. 16)                                                                       Filler (Ref.                                                                        --  --  --  --  --  --  1399.5                                                                            --  --  --                                  Ex. 17)                                                                       Filler (Ref.                                                                        --  --  --  --  --  --  --  1399.5                                                                            --  --                                  Ex. 18)                                                                       Filler (Ref.                                                                        --  --  --  --  --  --  --  --  1.399.5                                                                           --                                  Ex. 19)                                                                       Filler (Ref.                                                                        --  --  --  --  --  --  --  --  --  1788                                Ex. 20)                                                                       Epoxy resin                                                                         100 100 100 100 100 100 100 100 100 100                                 Curing                                                                              55.5                                                                              55.5                                                                              55.5                                                                              55.5                                                                              55.5                                                                              55.5                                                                              55.5                                                                              55.5                                                                              55.5                                                                              55.5                                Agent                                                                         Accelerator                                                                         1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5                                 Coupler                                                                             2   2   2   2   2   2   2   2   2   2                                   Demolding                                                                           1.78                                                                              1.78                                                                              1.78                                                                              1.78                                                                              1.78                                                                              1.78                                                                              1.78                                                                              1.78                                                                              1.78                                                                              1.78                                agent                                                                         Properties                                                                    Moldability                                                                         ×                                                                           ×                                                                           ×                                                                           ×                                                                           ×                                                                           ×                                                                           ×                                                                           ×                                                                           ×                                                                           ×                             Spiral flow                                                                         0.6 3.5 18.5                                                                              17.0                                                                              15.8                                                                              17.9                                                                              15.0                                                                              18.5                                                                              15.0                                                                              1                                   (inches)                                                                      __________________________________________________________________________

The epoxy resin compositions of the present invention exhibit anexcellent fluidity and can be loaded with a high percentage of filler.Accordingly, their cured products are lowered in the moisture absorptionand thermal expansion coefficient of which increases result from theresin itself present in the cured product.

Referential Examples 21-27

The globular silicas and fragmental fused silicas of which mean particlediameters were as shown in Table 1 were compounded at the compoundingratios (% by volume) shown in Table 6 and thoroughly homogenized toobtain the fillers of Referential Examples 21-27.

                                      TABLE 6                                     __________________________________________________________________________               Ref.                                                                              Ref.                                                                              Ref.                                                                              Ref.                                                                              Ref.                                                                              Ref.                                                                              Ref.                                       Formulation                                                                              Ex. 21                                                                            Ex. 22                                                                            Ex. 23                                                                            Ex. 24                                                                            Ex. 25                                                                            Ex. 26                                                                            Ex. 27                                     __________________________________________________________________________    Globular silica-1                                                                        12% 10.8%                                                                             10.8%                                                                             --  --  --  --                                         Globular silica-2                                                                        --  --  --  --   8% 28% 28%                                        Globular silica-3                                                                        20% 18% 18% --  --  --  --                                         Gldbular silica-4                                                                        --  --  --  --  11% 10% 20%                                        Globular silica-6                                                                        --  --  --  80% 81% 62% 52%                                        Globular silica-7                                                                        68% 61.2%                                                                             61.2%                                                                             --  --  --  --                                         Fragmental fused silica-1                                                                --  10% --  --  --  --  --                                         Fragmental fused silica-2                                                                --  --  10% 20% --  --  --                                         __________________________________________________________________________

Examples 11-15 and Comparative Examples 11-15

As epoxy resins, o-cresol novolac glycidyl ether (trade name SumiepoxyESCN-195, melt viscosity 2.6 poises/150° C., hydrolyzable chlorinecontent 180 ppm, manufactured by Sumitomo Chemical Industry Co., Ltd.;in Tables 7 and 8, referred to as "Epoxy 1") and a polyphenol glycidylether obtained by condensation of a phenol compound andhydroxybenzaldehyde (trade name Sumiepoxy TMH-574, melt viscosity 3.3poises/150° C., hydrolyzable chlorine content 400 ppm, manufactured bySumitomo Chemical Industry Co., Ltd.; in Tables 7 and 8, referred to as"Epoxy 2") were used. As a curing agent, phenol novolac (trade nameTamanol 759, manufactured by Arakawa Kagaku Co.) was used. As a curingaccelerator, triphenylphosphine was used. As a demolding agent, carnaubawax was used. As a coupler, SH-6040 (trade name, manufactured by TorayDow Corning Silicone Co.) was used. Each of the fillers of ReferentialExamples 21-27 was compounded with the above-mentioned ingredientsaccording to the compounding ratios (g) shown in Tables 7 and 8, heatedand kneaded on rolls, and molded by means of press. Further, the moldedproduct was post-cured in an oven at 180° C. for 5 hours to obtain acured product. The cured product thus obtained was examined on glasstransition temperature, water absorption, bending strength andmoldability. The results are shown in Tables 7 and 8.

                                      TABLE 7                                     __________________________________________________________________________                 Ex. 11                                                                              Ex. 12                                                                             Ex. 13                                                                              Ex. 14                                                                              Ex. 15                                    __________________________________________________________________________    Amt. of filler (% by wt.)                                                                  87.6% 84.6%                                                                              87.6% 87.6% 87.6%                                     Formulation                                                                   Filler (Ref. Ex. 21)                                                                       1129.9                                                                              --   --    --    --                                        Filler (Ref. Ex. 22)                                                                       --    873.1                                                                              1129.9                                                                              --    1094.9                                    Filler (Ref. Ex. 23)                                                                       --    --   --    1129.9                                                                              --                                        Epoxy-1      100   100  100   100   --                                        Epoxy-2      --    --   --    --    100                                       Curing agent 54.1  54.1 54.1  54.1  49.3                                      Accelerator  1.5   1.5  1.5   1.5   1.5                                       Coupler      2.3   2.2  2.3   2.2   2.3                                       Demolding agent                                                                            1.7   1.7  1.7   1.7   1.7                                       Properties                                                                    Moldability  Δ                                                                             ∘                                                                      ∘                                                                       ∘                                                                       ∘                             Spiral flow (inches)                                                                       23.2  35.1 22.5  23.5  31                                        Tg (°C.)                                                                            163   163  160   163   181                                       Heat expansion coeff. (°C..sup.-1)                                                  0.91 × 10.sup.-5                                                              1.1 × 10.sup.-5                                                              0.83 × 10.sup.-5                                                              0.85 × 10.sup.-5                                                              1.09 × 10.sup.-5                    Bending strength (kg/mm.sup.2)                                                             11.3  13.9 15.2  15.5  13.4                                      Water absorption (72 h)(%)                                                                 0.158 0.193                                                                              0.156 0.155 0.218                                     Crack resistance test                                                                      0/8   0/8  0/8   0/8   0/8                                       __________________________________________________________________________

                                      TABLE 8                                     __________________________________________________________________________                 Comp.                                                                              Comp.                                                                              Comp.                                                                              Comp.                                                                             Comp.                                                      Ex. 11                                                                             Ex. 12                                                                             Ex. 13                                                                             Ex. 14                                                                            Ex. 15                                        __________________________________________________________________________    Amt. of filler (% by wt.)                                                                  82.5%                                                                              75.4%                                                                              87.6%                                                                              87.6%                                                                             87.6%                                         Formulation                                                                   Filler (Ref. Ex. 24)                                                                       752.4                                                                              474  --   --  --                                            Filler (Ref. Ex. 25)                                                                       --   --   1129.9                                                                             --  --                                            Filler (Ref. Ex. 26)                                                                       --   --   --   1129.9                                                                            --                                            Filler (Ref. Ex. 27)                                                                       --   --   --   --  1.129.9                                       Epoxy-1      100  --   100  100 100                                           Epoxy-2      --   100  --   --  --                                            Curing agent 54.1 49.3 54.1 54.1                                                                              54.1                                          Accelerator  1.5  1.5  1.5  1.5 1.5                                           Coupling agent                                                                             2.2  2.2  2.3  2.3 2.3                                           Demolding agent                                                                            1.6  1.6  1.7  1.7 1.7                                           Properties                                                                    Moldability  ∘                                                                      ∘                                                                      x    x   x                                             Spiral flow (inches)                                                                       19.5 41.9 7    8   6                                             Tg (°C.)                                                                            160  176  Unmoldable                                             Heat expansion coeff. (°C..sup.-1)                                                  1.3 × 10.sup.-5                                                              2.2 × 10.sup.-5                                                              "                                                      Bending strength (kg/mm.sup.2)                                                             12.4 13.3 "                                                      Water absorption (72 h)(%)                                                                 0.219                                                                              0.349                                                                              Unmoldable                                             Crack resistance test                                                                      5/8  8/8  "                                                      __________________________________________________________________________

The molding epoxy resin compositions of the present invention exhibit anexcellent fluidity even when loaded with a high percentage of filler.Further, they are lowered in the moisture absorption and thermalexpansion coefficient of which increases result from the resin itselfpresent in the cured product, and their glass transition temperatures(Tg) are 150° C. or above.

Referential Examples 28-34

Globular silicas and fragmental fused silicas of which mean particlediameters were as shown in Table 1 were compounded at compounding ratios(g) shown in Table 9 and thoroughly homogenized to obtain the fillers ofReferential Examples 28-34.

                                      TABLE 9                                     __________________________________________________________________________                 Ref.                                                                              Ref. Ref.                                                                              Ref.                                                                              Ref.                                                                              Ref.                                                                              Ref.                                    Formulation  Ex. 28                                                                            Ex. 29                                                                             Ex. 30                                                                            Ex. 31                                                                            Ex. 32                                                                            Ex. 33                                                                            Ex. 34                                  __________________________________________________________________________    Globular silica-1                                                                          12% 10.8%                                                                              --  --  --  --  --                                      Globular silica-2                                                                          --  --   --   8% 30% 25%  8%                                     Globular silica-3                                                                          20% 18%  --  --  --  --                                          Globular silica-4                                                                          --  --   --  11% 20% --  22%                                     Globular silica-5                                                                          --  --   --  --  --  21%                                         Globular silica-6                                                                          --  --   80% 81% 50% 54% 70%                                     Globular silica-7                                                                          68% 61.2%                                                                              --  --  --  --                                          Fragmental fused silica-1                                                                  --  --   --  --  --  --                                          Fragmental fused silica-2                                                                  --  10%  20% --  --  --                                          __________________________________________________________________________

Examples 16-25 and Comparative Examples 16-20

As epoxy resins, o-cresol novolac glycidyl ether (trade name SumiepoxyESCN-195, melt viscosity 2.6 poises/150° C., hydrolyzable chlorinecontent 180 ppm, manufactured by Sumitomo Chemical Industry Co., Ltd.;in Tables 10, 11 and 12, referred to as "Epoxy 1") was used. As imides,N,N'-4,4'-diaminodiphenylmethane-bismaleimide (trade name BestlexBH-180, melt viscosity 2.4 poises/175° C., manufactured by SumitomoChemical Industry Co., Ltd.; in Tables 10, 11 and 12, referred to as"Imide 1") and N,N'-bis 4-(4-(aminophenoxy)phenyl!menthane-bismaleimide(trade name Bestlex MPD, melt viscosity 7.3 poises/175° C., manufacturedby Sumitomo Chemical Industry Co., Ltd.; in Tables 10, 11 and 12,referred to as "Imide 2") were used. As a curing agent, phenol novolac(trade name Tamanol 759, manufactured by Arakawa Kagaku Co.) was used.As a curing accelerator, triphenylphosphine (in Tables 10, 11 and 12referred to as "Catalyst 1") and tetraphenylphosphoniumtetraphenylborate (in Tables 10, 11 and 12, referred to as "Catalyst 2")were used. As a demolding agent, carnauba wax was used. As a coupler,SH-6040 (trade name, manufactured by Toray Dow Corning Silicone Co.; inTables 10, 11 and 12, referred to as "Coupler 1") and KBM-573 (tradename, manufactured by Shin'Etsu Kagaku Kogyo Co.; in Tables 10, 11 and12, referred to as "Coupler 2") were used. Each of the fillers ofeferential Examples 28-34 was compounded with the above-mentionedingredients according to the compounding ratios (g) shown in Tables 10and 11, heated and kneaded on rolls, and molded by means of press.Further, the molded product was post-cured in an oven at 200° C. for 5hours to obtain a cured product. The cured product thus obtained wasexamined on glass transition temperature, water absorption, bendingstrength and moldability. The results are shown in Tables 10, 11 and 12.

                                      TABLE 10                                    __________________________________________________________________________                 Ex. 16                                                                              Ex. 17                                                                              Ex. 18                                                                              Ex. 19                                                                             Ex. 20                                    __________________________________________________________________________    Amt. of filler (% by wt.)                                                                  87.4% 87.4% 84.3% 87.6%                                                                              84.3%                                     Formulation                                                                   Filler (Ref. Ex. 28)                                                                       2824.8                                                                              --    --    2824.8                                                                             2182.8                                    Filler (Ref. Ex. 29)                                                                       --    2824.8                                                                              2182.8                                                                              --   --                                        Imide-1      231.1 231.1 231.1 --   --                                        Imide-2      --    --    --    231.1                                                                              231.1                                     Epoxy-1      100   100   100   100  100                                       Curing agent 54.1  54.1  54.1  54.1 54.1                                      Catalyst-1   1.54  1.54  1.54  1.54 1.54                                      Catalyst-1   7.7   7.7   7.7   7.7  7.7                                       Coupler-1    4.46  4.46  4.31  4.46 4.31                                      Coupler-2    4.46  4.46  4.31  4.46 4.31                                      Demolding agent                                                                            3.1   3.1   3     3.1  3                                         Properties                                                                    Moldability  ∘                                                                       ∘                                                                       ∘                                                                       ∘                                                                      ∘                             Spiral flow (inches)                                                                       28    26.5  42.2  20.2 28.4                                      Tg (°C.)                                                                            231   226   236   222  220                                       Heat expansion coeff. (°C..sup.-1)                                                  0.72 × 10.sup.-5                                                              0.71 × 10.sup.-5                                                              0.77 × 10.sup.-5                                                              0.7 × 10.sup.-5                                                              0.85 × 10.sup.-5                    Bending strength (kg/mm.sup.2)                                                             18.8  16.3  15    18.1 17.8                                      Water absorption (72 h) (%)                                                                0.302 0.311 0.382 0.270                                                                              0.312                                     Crack resistance test                                                                      0/8   0/8   0/8   0/8  0/8                                       __________________________________________________________________________

                                      TABLE 11                                    __________________________________________________________________________                                            Comp.                                           Ex. 21                                                                              Ex. 22                                                                              Ex. 23                                                                              Ex. 24                                                                              Ex. 25                                                                              Ex. 16                                __________________________________________________________________________    Amt. of filler                                                                          81.2% 87.4% 84.3% 81.2% 90.0% 75.1%                                 (% by wt.)                                                                    Formulation                                                                   Filler (Ref. Ex. 28)                                                                    1754.8                                                                              --    --    --    --    --                                    Filler (Ref. Ex. 29)                                                                    --    2824.8                                                                              2182.8                                                                              1754.8                                                                              3661.4                                                                              --                                    Filler (Ref. Ex. 30)                                                                    --    --    --    --    --    1218.1                                Imide-1   --    --    --    --    231.1 --                                    Imide-2   231.1 231.1 231.1 231.1 --    231.1                                 Epoxy-1   100   100   100   100   100   100                                   Curing agent                                                                            54.1  54.1  54.1  54.1  54.1  54.1                                  Catalyst-1                                                                              1.54  1.54  1.54  1.54  1.54  1.54                                  Catalyst-2                                                                              7.7   7.7   7.7   7.7   7.7   7.7                                   Coupler-1 4.16  4.46  4.31  4.16  4.59  3.85                                  Coupler-2 4.16  4.46  4.31  4.16  4.59  3.85                                  Demolding agent                                                                         2.9   3.1   3     2.9   3.2   2.7                                   Properties                                                                    Moldability                                                                             ∘                                                                       ∘                                                                       ∘                                                                       ∘                                                                       ∘                                                                       ∘                         Spiral flow (inches)                                                                    37.1  21.2  37.5  39.5  20.2  40                                    Tg (°C.)                                                                         222   221   221   223   231   230                                   Heat expansion coeff.                                                                   1.01 × 10.sup.-5                                                              0.67 × 10.sup.-5                                                              0.98 × 10.sup.-5                                                              1.11 × 10.sup.-5                                                              0.56 × 10.sup.-5                                                              1.85 × 10.sup.-5                (°C..sup.-1)                                                           Bending strength                                                                        19.3  15.8  15.3  16.4  16.9  13.1                                  (kg/mm.sup.2)                                                                 Water absorption                                                                        0.342 0.270 0.312 0.357 0.268 0.418                                 (72 h) (%)                                                                    Crack resistance test                                                                   0/8   0/8   0/8   0/8   0/8   4/8                                   __________________________________________________________________________

                                      TABLE 12                                    __________________________________________________________________________               Comp. Ex. 17                                                                         Comp. Ex. 18                                                                         Comp. Ex. 19                                                                         Comp. Ex. 20                                  __________________________________________________________________________    Amt. of filler (% by wt.)                                                                87.4%  87.4%  87.4%  87.4%                                         Formulation                                                                   Filler (Ref. Ex. 31)                                                                     2824.8 --     --     --                                            Filler (Ref. Ex. 32)                                                                            2824.8 --     --                                            Filler (Ref. Ex. 33)                                                                     --     --     2824.8 --                                            Filler (Ref. Ex. 34)                                                                     --     --     --     2824.8                                        Imide-1    231.1  231.1  231.1  231.1                                         Imide-2    --     --     --     --                                            Epoxy-1    100    100    100    100                                           Curing agent                                                                             54.1   54.1   54.1   54.1                                          Catalyst-1 1.54   1.54   1.54   1.54                                          Catalyst-2 7.7    7.7    7.7    7.7                                           Coupler-1  4.46   4.46   4.46   4.46                                          Coupler-2  4.46   4.46   4.46   4.46                                          Demolding agent                                                                          3.1    3.1    3.1    3.1                                           Properties                                                                    Moldability                                                                              x      x      x      x                                             Spiral flow (inches)                                                                     16.5   0      9      6.5                                           Crack resistance test                                                                    Difficult to mold                                                  __________________________________________________________________________

The molding imide resin compositions of the present invention exhibit anexcellent fluidity even when loaded with a high percentage of filler.Further, their cured products are lowered in the moisture absorption andthermal expansion coefficient of which increase result from the resinitself present in the cured product, and their glass transitiontemperatures (Tg) are 200° C. or above.

The resin compositions of the present invention exhibit an excellentfluidity even when loaded with a high percentage of filler. Further,their cured products are lowered in the moisture absorption and thermalexpansion coefficient of which increases result from the resin itselfpresent in the cured product. Further, a semi-conductor package sealedwith the resin composition of the present invention exhibits a highpackage crack resistance. As above, the resin compositions of thepresent invention are suitable for use as a sealing material forsemi-conductors. Further, the resin composition of the present inventionis extensively applicable to other uses requiring a high-percentageloading of filler.

What is claimed is:
 1. A semi-conductor package obtained by sealing asemi-conductor with a molding composition, and curing the moldingcomposition in the presence of a curing accelerator to form thesemi-conductor package, wherein the uncured molding compositioncontains:(A) a resin and a filler therein, said filler comprising aglobular powder of which the mean particle diameter is not smaller than0.1 μm and not greater than 1.5 μm (x component), a globular powder ofwhich the mean particle diameter is not smaller than 2 μm and notgreater than 10 μm (y component) and a globular powder of which the meanparticle diameter is not smaller than 20 μm and not greater than 70 μm(z component), wherein proportions of the x, y and z components based onthe total volume of x, y and z components are not smaller than 10% byvolume and not greater than 24% by volume, not smaller than 0.1% byvolume and not greater than 30% by volume and not smaller than 57% byvolume and not greater than 76% by volume, respectively; or (B) a resinand a filler therein, said filler comprising a globular powder of whichmean particle diameter is not smaller than 0.1 μm and not greater than1.5 μm (x component), a globular powder of which the mean particlediameter is not smaller than 2 μm and not greater than 10 μm (ycomponent), a globular powder of which mean particle diameter is notsmaller than 20 μm and not greater than 70 μm (z component), and acrushed powder (m component), wherein proportions of the x, y and zcomponents based on the total volume of x, y and z components are notsmaller than 10% by volume and not greater than 24% by volume, notsmaller than 0.1% by volume and not greater than 30% by volume and notsmaller than 57% by volume and not greater than 76% by volume,respectively, and a proportion of the m component is not smaller than 1%by weight and not greater than 30% by weight based on the total weightof x, y, z and m components.
 2. The semi-conductor package of claim 1,wherein the curing accelerator is used in an amount from 0.1 to 10 partsby weight of curing accelerator per 100 parts by weight of resin.
 3. Thesemi-conductor package of claim 1, wherein in said sealing and curing, acuring agent used in a curing agent-to-resin ratio from 0.7 to 1.2. 4.The semi-conductor package of claim 1, wherein the resin of said uncuredmolding composition is an imide resin, an epoxy resin, or a combinationof both.
 5. The semi-conductor package of claim 4, wherein the epoxyresin has a melt viscosity at 150° C. from 1 poise to 20 poise.
 6. Thesemi-conductor package of claim 5, wherein the uncured moldingcomposition further comprises another epoxy resin which has a meltviscosity at 150° C. lower than 1 poise.
 7. The semi-conductor packageof claim 4, wherein the imide resin is a maleimide compound.
 8. Thesemi-conductor package of claim 4, wherein the uncured moldingcomposition contains an epoxy resin and an imide resin, said imide resincomprising maleimide compound, wherein said uncured molding compositioncontains said epoxy resin and said maleimide compound in a ratio of 2 to900 parts by weight of the epoxy resin per 100 parts by weight of themaleimide compound.
 9. The semi-conductor package of claim 7, whereinthe uncured molding composition contains filler in an amount of not lessthan 50% by weight and not greater than 95% by weight bases on totalweight of the uncured molding composition.
 10. The semi-conductorpackage of claim 4, wherein the uncured molding composition furthercomprises an alkenyl compound.
 11. The semi-conductor package accordingto claim 12, wherein the curing accelerator is used in an amount from0.5 to 3 parts by weight of curing accelerator per 100 parts by weightof resin.
 12. A semi-conductor package obtained by sealing asemi-conductor with a molding composition, wherein the uncured moldingcomposition contains:(A) a resin and a filler therein, said fillercomprising a globular powder of which the mean particle diameter is notsmaller than 0.1 μm and not greater than 1.5 μm (x component), aglobular powder of which the mean particle diameter is not smaller than2 μm and not greater than 10 μm (y component) and a globular powder ofwhich the mean particle diameter is not smaller than 20 μm and notgreater than 70 μm (z component), wherein proportions of the x, y and zcomponents based on the total volume of x, y and z components are notsmaller than 10% by volume and not greater than 24% by volume, notsmaller than 0.1% by volume and not greater than 30% by volume and notsmaller than 57% by volume and not greater than 76% by volume,respectively; or (B) a resin and a filler therein, said fillercomprising a globular powder of which mean particle diameter is notsmaller than 0.1 μm and not greater than 1.5 μm (x component), aglobular powder of which the mean particle diameter is not smaller than2 μm and not greater than 10 μm (y component), a globular powder ofwhich mean particle diameter is not smaller than 20 μm and not greaterthan 70 μm (z component), and a crushed powder (m component), whereinproportions of the x, y and z components based on the total volume of x,y and z components are not smaller than 10% by volume and not greaterthan 24% by volume, not smaller than 0.1% by volume and not greater than30% by volume and not smaller than 57% by volume and not greater than76% by volume, respectively, and a proportion of the m component is notsmaller than 1% by weight and not greater than 30% by weight based onthe total weight of x, y, z and m components; and wherein said sealing,a curing agent and a curing accelerator for said molding resin are used.13. The semi-conductor package of claim 12, wherein the curingaccelerator is used in an amount from 0.1 to 10 parts by weight ofcuring accelerator per 100 parts by weight of resin.
 14. Thesemi-conductor package of to claim 12, wherein said curing acceleratoris used in an amount from 0.5 to 3 parts by weight of curing acceleratorper 100 parts by weight of resin.
 15. The semi-conductor package ofclaim 12, wherein the curing agent is used in a curing agent-to-resinratio from 0.7 to 1.2.
 16. The semi-conductor package of claim 12,wherein the resin of said uncured molding composition is an imide resin,an epoxy resin, or a combination of both.
 17. The semi-conductor packageof claim 16, wherein the epoxy resin has a melt viscosity at 150° C.from 1 poise to 20 poise.
 18. The semi-conductor package of claim 17,wherein the uncured molding composition further comprises another epoxyresin which has a melt viscosity at 150° C. lower than 1 poise.
 19. Thesemi-conductor package of claim 16, wherein the imide resin is amaleimide compound.
 20. The semi-conductor package of claim 16, whereinthe uncured molding composition contains an epoxy resin and an imideresin, said imide resin comprises a maleimide compound, and said uncuredmolding composition contains said epoxy resin and said maleimidecompound in a ratio of 2 to 900 parts by weight of the epoxy resin per100 parts by weight of the maleimide compound.
 21. The semi-conductorpackage of claim 19, wherein the uncured molding composition containsfiller in an amount of not less than 50% by weight and not greater than95% by weight based on the total weight of the uncured moldingcomposition.
 22. The semi-conductor package of claim 15, wherein theuncured molding resin composition further comprises an alkenyl compound.23. The semi-conductor package of claim 16, wherein the curingaccelerator is used in an amount from 0.5 to 3 parts by weight of curingaccelerator per 100 parts by weight of resin.
 24. The semi-conductorpackage of claim 23, wherein the resin of said uncured moldingcomposition comprises an imide resin, an epoxy resin or a combination ofboth.
 25. The semi-conductor package of claim 24, wherein said curingaccelerator is used in an amount of 0.1 to 13 parts by weight per 100parts by weight of resin.